Applications are now open to Malaysians for scholarship awards offered by the following educational institutions.

Eligibility
• be Malaysian citizens of not more than 25 years of age as at 1st January 2008.
• have excelled in extra-curricular activities and active in sports.
• not be bonded to or in any receipt of any financial aid or awards from other educational institutions or organizations.
• for Foundation/Diploma courses, applicants must possess reasonably good results in the SPM/UEC or equivalent.
• for Higher and Advanced Diploma/Degree courses, applicants must possess reasonably good results in the STPM/A-Level/
UEC or equivalent

Application Procedure
• For further details on individual university’s / college’s scholarship awards and to obtain an application form, please visit our website at http://thestar.com.my/edufund or submit a stamped (40 sen) self-addressed envelope (25cm x 30cm) to:

Manager
The Star Education Fund
c/o Star Publications (M) Bhd
Menara Star
15 Jalan 16/11 Section 16
46350 Petaling Jaya Selangor

• Completed application forms with the required certified supporting documents listed in the application forms must be received by (2) two weeks after the release of SPM / STPM results. Late applications will not be accepted. Only short-listed applicants will be notified.

Popularity: 61% [?]

At the tertiary level, Yayasan provides various scholarships and bursaries to outstanding students pursuing degree courses in recognized local institution of higher learning in disciplines related to Agriculture and the Oil Palm Manufacturing industry.

The scholarship is opened for application between May to June every year. Advertisement will be put up in the major local newspapers to notify the public.

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Popularity: 8% [?]

Since its establishment in 1986, HELP University College has awarded many scholarships to encourage academically inclined Malaysian and international students who display leadership qualities to pursue tertiary education at the University College. Many of these recipients have completed their courses and have embarked successfully on their careers.

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Popularity: 8% [?]

University Of The Ozarks with the collaboration of www.varsityinternational.com has now open for application of scholarship to pursue studies in USA.

Through this program will give an opportunity to students to participate the Summer Internship Program during their final year.

For details. VISIT HERE.

Popularity: 5% [?]

Education is the most important investment one makes in life. Whether you need to pay for your children’s studies or your own, our education loan help you finance up to the full cost of education.

Eligibility

For full time students:

• Joint borrower between the students and one co-borrower.
• Acceptable co-borrower are: Parents, siblings, relatives or guardians with adequate repayment capacity
• Student must be 18 years old or above.

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Popularity: 14% [?]

Smart is learning all you can
Competitive times require continuous learning. If you’re ready for higher education, Maybank can make your pursuit a smoother one with less financial worries.

Smart is paying what you can
Our innovative repayment plans offer you lower repayments so that you can enjoy peace of mind and focus on excelling in your examinations.

Find out details.

Popularity: 8% [?]

Elektrisola is offering its Scholarship Award to any interested Malaysian citizen who has been offered or is currently undergoing full-time degree programme at any recognised college/university in Malaysia. Interested candidates who fulfill all the requirements stated below are invited to apply.

Field of Study (Recognised Degree Programme)

• Engineering
• Information Technology
• Management

Requirement

• Malaysian citizen between the ages of 18 and 22
• Minimum 5As in SPM or 3Bs in STPM examination
• Has been offered a degree programme in recognised college/university
• For full time college student, must meet a minimum CGPA of 3.30 and are not bonded or receive any financial support from any institution/organisation.

How to Apply

Submit your application together with

• A cover letter, applying for the scholarship
• A copy of resume
• A copy of PMR/SPM/STPM and latest examination results
• A copy of offer letter from the current college/university indicating the field of study and the duration of the course
• Recent passport size photograph

For further information contact:

The Human Resource Manager,
Elektrisola (M) Sdn.Bhd.,
Jalan Damai Satu,Janda Baik,
28750 Bentong,Pahang Darul Makmur
Tel: 09-2210888
Fax: 09-2210805

Closing date: 31 March 2007

Popularity: 10% [?]

The PTPTN Education Loan Scheme was set up with the aim of providing education loans to students pursuing their studies in local institutions of higher learning (IPT). This loan will enable students to fully or partially pay their fees and their subsistence for the duration of their study in the IPT. Thus, this scheme provides greater opportunities to students to continue their tertiary education.

Please click here for details.

Popularity: 7% [?]

This foundation was established by FELCRA aiming at providing scholarships and loans to qualified Malaysian students.

For more information, click here.

Popularity: 11% [?]

PNB offers scholarships to Bumiputeras who obtain exceptional results in their Sijil Pelajaran Malaysia to pursue tertiary education at selected foreign universities in disciplines related to the business activity of PNB such as Finance & Investment, Accountancy, Economics, Law, Information Communication Technology and Engineering.

Prior to entry into universities, the scholars will be required to undertake a two-year A-Level programmme or other preparatory programmes determined by PNB.

For details, visit PNB.

Popularity: 25% [?]

The Hong Leong Group Malaysia, through Hong Leong Foundation, has long been committed to a policy of social responsibility by contributing towards the welfare of the society.

The Hong Leong Foundation Scholarship Programme is aimed towards helping young and deserving Malaysians who have achieved excellent academic results to attain their goals and be successful in life. Besides financial assistance, the programme provides personal development opportunities to help graduates reach their full potential.

Eligibility

1. The scholarships are awarded to students pursuing courses in Accounting, Law, Business Studies, Finance & Management, Science / Actuarial Science, Engineering (all fields), Hotel Management, IT, Computer Science & Creative Multimedia.
2. The academic requirements for sponsorship

• SPM - at least 5As and 2 passes from a minimum of 7 subjects.
• STPM - at least 3As and a pass in the General Paper .
• CGPA - at least 3.5 for Diploma or Matriculation

About Sponsorship & Contractual Obligation

1. It is open to Malaysian citizens, who sat for the SPM/STPM/Diploma/Matriculation examination in 2007
2. The scholarship is only for full time courses conducted in Malaysia. It is a non-bonding scholarship. There is no obligation to serve the Group, though you are encouraged to join the Group.
3. You are not allowed to change course without prior approval from Hong Leong Foundation.

The agreed amount will be banked into the student’s Hong Leong Bank account once a year.

Application should be based on your first choice of course/field of study and institution applied to. Between 25 to 30 awards will be granted a year.

The scholarship amount

• Undergraduate studies at local universities RM 7,000/= p.a.
• Diploma/Advanced Diploma courses at local institutions RM 5,000/= p.a.
• Undergraduate studies at local private universities Up to RM20,000/= p.a. ( “3+0” degree programmes on full-time and on-campus basis)

The amount awarded will be paid out once a year for the duration of your course.

When will application be open again?

From 12 March 2008. Please see press announcement in Nanyang Siang Pau, The Star and Mingguan Malaysia.

Where can I get the application Form?
Application forms may be obtained at :

• all Hong Leong Bank Berhad branches in Malaysia during office hours
• by downloading from http://www.hongleong.com/community/2008
• by submitting a stamped (50 sen) self addressed 11cm x 24cm envelope to :

Hong Leong Foundation Scholarship Programme, Level 10, Wisma Hong Leong, 18 Jalan Perak, 50450 Kuala Lumpur.

What other benefits come with the scholarship?

Apart from financial assistance, the Hong Leong Foundation Scholarship Programme also offers opportunities for industrial training at relevant group subsidiary companies.

Application for the HONG LEONG FOUNDATION SCHOLARSHIP PROGRAMME is now open. Closing date is on 18th April 2008.

Popularity: 24% [?]