Good news ! HP & AMD scholarship awards is now open for application. WhatI want to comment is their unique website, very interactive and user friendly too.

I don’t plan to write long, but justread their FAQs page which I pasted here :

1. When is the scholarship application submission deadline?
The scholarship application submission duration is from 11 August 2008 to 30 September 2008.

2. What is the scholarship value?
Successful recipients will each receive a scholarship package worth RM25,000.

3. How will the scholarship be disbursed?
The scholarships shall be disbursed on a lump sump basis and shall be paid directly to the recipients.

4. Is this a bonded scholarship?
No. This is a non-bonded scholarship.

5. Can I apply if I am a part-time student?
Yes. This scholarship program is opened to all students who fulfill the eligibility criteria.

6. Is this scholarship for undergraduate students only?
No. This scholarship program is opened to both undergraduate & postgraduate students.

7. How do I apply?
Application is via online submission ONLY at www.hp.com.my/Scholarship with certified true copies of relevant documents mailed by post. Application is considered complete when both online application and hard copy of supporting documents are received.

8. How many applications can I submit?
Each applicant is allowed to apply ONCE only.

The closing date is on 30 September 2008.

Visit HP & AMD website to apply.

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Comments

  1. hamid

    i really interested in this scholarship, but i will only finished my bachelor this October. can i still apply this scholarship? How?

  2. zrol

    how i want apply this schoolarship?i really interested about this
    now,i’m still studying at ledang community collegue at johor,
    taking course certificate technology automotive
    hope,you can help me apply this schoolarship.